Folasaga: Lu'itau Fa'ainisinia i Ta'avale Fa'aeletonika maCapel's Innovations

A'o fa'atupula'ia le ta'avale tuto'atasi aga'i i le L5 ma le ta'avale eletise (EV) fa'atonuga o ma'a (BMS) e mana'omia ai le maualuga o le malosi ma le saogalemu, o tekonolosi PCB masani e tauivi e foia fa'afitauli ogaoga:

• Tulaga Mata'utia Fa'avevela: ECU chipsets sili atu i le 80W le faʻaaogaina o le eletise, ma le vevela faʻapitonuʻu e oʻo atu i le 150°C
• Tapulaa Tuufaatasi 3D: BMS manaʻomia 256+ alavai faailoilo i totonu 0.6mm mafiafia laupapa
• Fa'aletonu le Vibration: E tatau ona fa'asagatau masini fa'ate'ia 20G
• Manaoga Laiti: LiDAR pule e manaʻomia le 0.03mm le lautele o le faʻasologa ma le faʻapipiʻiina o le 32

Capel Tekonolosi, faʻaaogaina 15 tausaga o le R&D, faʻalauiloa se fofo suiga tuʻufaʻatasiaPCBs conductivity vevela maualuga(2.0W/mK),PCBs maualuga-vevela(-55°C~260°C), ma32-vaegaHDI tanumia/tauaso e ala i tekinolosi(0.075mm microvias).

Vaega 1: Su'ega Fa'a vevela mo ECU Aveta'avale Tutoatasi

1.1 ECU Lu'itau vevela

• Nvidia Orin chipset vevela vevela: 120W/cm²
• O mea masani FR-4 (0.3W/mK) e mafua ai le 35% o le vevela o le vevela o le va'a
• 62% o le faaletonu o le ECU e mafua mai i le vaivai o le solder e mafua mai i le vevela

1.2 Capel's Thermal Optimization Tekinolosi

Mea Fa'afouga:

• Nano-alumina fa'amalosia polyimide substrates (2.0±0.2W/mK fa'avevela vevela)
• Fa'asologa o pou 'apamemea 3D (400% fa'atuputeleina le vaega o le vevela)

Fa'asologa o Fa'agasologa:

• Laser Direct Structuring (LDS) mo auala fa'amama fa'alelei
• Fa'aputuga fa'aputu: 0.15mm apamemea sili ona manifinifi + 2oz fa'a'apa apamemea mamafa

Faatusatusaga o Galuega:

Vaega 2: BMS Wiring Revolution ma 32-Layer HDI Technology

2.1 Alamanuia Manatu Manatu ile BMS Design

• 800V platforms manaʻomia 256+ cell voltage mataʻituina auala
• O mamanu masani e sili atu i tapula'a avanoa e 200% fa'atasi ai ma le 15% impedance mismatch

2.2 Capl's High-Density Interconnect Solutions

Faaputuga Inisinia:

• 1+N+1 so'o se fa'avae HDI fausaga (32 apa ile 0.035mm mafiafia)
• ± 5% fa'atonuga fa'alavelave fa'apitoa (10Gbps fa'ailoga maualuga-saosaoa)

Microvia Tekonolosi:

• 0.075mm leisa-tauaso vias (12:1 fua fa'atatau)
• <5% fua fa'aleaogaina (IPC-6012B Vasega 3 fa'amalie)

I'uga Fa'ailoga:

Vaega 3: Fa'atuatuaina Tulaga Siosiomaga – Fofo Fa'amaonia MIL-SPEC

3.1 Fa'atinoga o Meafaitino Maualuga-Sua

• Matausa Suiga Temp (Tg): 280°C (IPC-TM-650 2.4.24C)
• Su'ega Su'ega (Td): 385°C (5% pa'u mamafa)
• Fa'aola Te'i Te'i: 1,000 ta'amilosaga (-55°C↔260°C)

3.2 Tekonolosi Puipuiga Pulea

• Fa'apipi'i fa'apipi'i fa'amasima (1,000h tete'e masima)
• 3D EMI pupuni pupuni (60dB fa'aitiitia @10GHz)

Vaega 4: Tulaga Su'esu'ega - Galulue faatasi ma le Global Top 3 EV OEM

4.1 800V BMS Pule Fa'atonu

• Lu'i: Fa'atasi le 512-auala AFE ile 85×60mm avanoa
• Fofo:
  1. 20-vaega ma'a'a-fe'ilo'i PCB (3mm fa'ao'o pi'o)
  2. Feso'ota'iga fa'amauina o le vevela (0.03mm le lautele)
  3. Fa'amama fa'apitonu'u-autu (0.15°C·cm²/W tete'e vevela)

4.2 L4 Pule Fa'atonu Tutoatasi

• I'uga:
  • 40% fa'aitiitiga malosi (72W → 43W)
  • 66% fa'aitiitiga lapo'a fa'atusatusa i mamanu masani
  • ASIL-D fa'amaonia le saogalemu o galuega

Vaega 5: Tusipasi ma Fa'amautinoaga Tulaga

O le tulaga lelei a Capel e sili atu nai lo tulaga tau taavale:

• MIL-SPEC Tusipasi: Faʻatasi ma le GJB 9001C-2017
• Tausia o Taavale: IATF 16949:2016 + AEC-Q200 faʻamaonia
• Su'ega Fa'atuatuaina:
  • 1,000h HAST (130°C/85% RH)
  • 50G te'i masini (MIL-STD-883H)

Fa'ai'uga: Next-Gen PCB Technology Roadmap

Capel o loo paeonia:

• Fa'apipi'i vaega ga'o (30% sefe avanoa)
• Optoelectronic hybrid PCBs (0.2dB/cm gau @850nm)
• Faiga DFM fa'atautaia AI (15% fa'aleleia o fua)

Fa'afeso'ota'i la matou 'au fa'ainisiniai aso nei e fa'atupu fa'atasi ai fofo PCB fa'apitoa mo au masini fa'aeletonika ta'avale e sosoo ai.